Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture and Mechanical Driving Forces
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture and Mechanical Driving Forces

SKU: 9781845695286

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Additional information

Full Title

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture and Mechanical Driving Forces
Author(s)

Wong, E-H, Mai, Y.-W.
Edition
ISBN

9781845695286, 9780857099112
Publisher

Woodhead Publishing
Format

PDF and EPUB

Description

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

  • Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
  • Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
  • Includes program files and macros for additional study

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