Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition

SKU: 9780071753807

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Additional information

Full Title

Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition
Author(s)

John H. Lau
Edition

1st Edition
ISBN

9780071753807, 9780071753791
Publisher

McGraw-Hill
Format

PDF and EPUB

Description

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Related products

Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition
-84%
Availability: In Stock

Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition

SKU: 9780071753791

Original price was: $161.00.Current price is: $24.99.

Access Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition Now. Discount up to 90%

Categories: ,

Additional information

Full Title

Reliability of RoHS-Compliant 2D and 3D IC Interconnects 1st Edition
Author(s)

Lau, John
Edition

1st Edition
ISBN

9780071753791
Publisher

McGraw-Hill Professional Publishing
Format

PDF and EPUB

Description

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

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