Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement 1st Edition
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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement 1st Edition

SKU: 9780429680069

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Additional information

Full Title

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement 1st Edition
Author(s)

Yue Ma, Christian Gontrand
Edition

1st Edition
ISBN

9780429680069, 9780367023430, 9780429399619, 9780429680076, 9780429680052
Publisher

CRC Press
Format

PDF and EPUB

Description

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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