Modeling and Application of Flexible Electronics Packaging
-75%
Availability: In Stock

Modeling and Application of Flexible Electronics Packaging

SKU: 9789811336270

Original price was: $99.00.Current price is: $24.99.

Access Modeling and Application of Flexible Electronics Packaging Now. Discount up to 90%

Categories: ,

Additional information

Full Title

Modeling and Application of Flexible Electronics Packaging
Author(s)

YongAn Huang, Zhouping Yin, Xiaodong Wan
Edition
ISBN

9789811336270, 9789811336263
Publisher

Springer
Format

PDF and EPUB

Description

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Related products