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| Full Title | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® |
|---|---|
| Author(s) | Erdogan Madenci, Ibrahim Guven, Bahattin Kilic |
| Edition | |
| ISBN | 9781461502555, 9781461349891, 9781402073304 |
| Publisher | Springer |
| Format | PDF and EPUB |
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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