Advances in 3D Integrated Circuits and Systems
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Advances in 3D Integrated Circuits and Systems

SKU: 9789814699037

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Additional information

Full Title

Advances in 3D Integrated Circuits and Systems
Author(s)

Hao Yu, Chuan Seng Tan
Edition
ISBN

9789814699037, 9789814699006, 9789814699013, 9789814699020
Publisher

World Scientific
Format

PDF and EPUB

Description

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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Advances In 3d Integrated Circuits And Systems
-70%
Availability: In Stock

Advances In 3d Integrated Circuits And Systems

SKU: 9789814699020

Original price was: $46.00.Current price is: $13.80.

Access Advances In 3d Integrated Circuits And Systems Now. Discount up to 90%

Categories: ,

Additional information

Full Title

Advances In 3d Integrated Circuits And Systems
Author(s)

Yu Hao
Edition
ISBN

9789814699020, 9789814699006
Publisher

World Scientific
Format

PDF and EPUB

Description

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Related products