3D Stacked Chips From Emerging Processes to Heterogeneous Systems
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3D Stacked Chips From Emerging Processes to Heterogeneous Systems

SKU: 9783319204819

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Additional information

Full Title

3D Stacked Chips From Emerging Processes to Heterogeneous Systems
Author(s)

Ibrahim (Abe) M. Elfadel
Edition
ISBN

9783319204819, 9783319204802
Publisher

Springer
Format

PDF and EPUB

Description

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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